Components of an electronic device and methods for their assembly

ABSTRACT

Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 61/689,170, filed May 29, 2012, which is incorporated byreference herein in its entirety.

FIELD OF THE INVENTION

Various components of an electronic device housing and methods for theirassembly are disclosed.

BACKGROUND OF THE DISCLOSURE

Portable electronic devices may be constructed using differentapproaches. For instance, an electronic device can be constructed byassembling several components together. These “components” can includeexternal components that are combined to form a device enclosure (e.g.,a device “housing”), as well as internal components that may providestructural support or other functionality for the electronic device(e.g., coupling members, fasteners, and electronic components). Based onthe design of the electronic device, the external and internalcomponents can be formed from any suitable material(s) including metalsand plastics.

SUMMARY OF THE DISCLOSURE

Portable electronic devices are disclosed. A portable electronic devicemay be assembled from a number of internal and external components. Inparticular, the portable electronic device may include an enclosureassembled from two or more sections physically joined together withcoupling members. A cover glass may be coupled to an outside edge of thedisclosure, and the cover glass and enclosure, together, can define avolume for retaining the internal components of the electronic device.

According to some embodiments, the sections of the enclosure may beformed from one or more electrically conducting materials. The couplingmembers may be formed from one or more dielectric, insulating materials,which can electrically isolate the various electrically conductivesections of the enclosure. The coupling members may also span an entirewidth of the enclosure. Cover plates can be coupled to the couplingmembers on a side of the electronic device opposing the cover glass.

According to some embodiments, the sections of the enclosure may beformed from separately extruded parts. For example, the enclosure mayinclude a top section, a center section, and a bottom section that areextruded separately and joined together using coupling members. Theextruded sections of the enclosure may be assembled such that thelongitudinal extrusion axes of one or more of the sections (e.g., thetop and bottom sections) are perpendicular to the longitudinal axis ofat least one other section (e.g., the center section). Materials andextrusion parameters may be chosen such that the separately extrudedsections have a continuous, unibody appearance once they are joinedtogether by the coupling members. In particular, grains in the extrudedsections may be minimized or eliminated or appear continuous between theextruded sections of the enclosure.

According to further embodiments, the coupling members may be formedusing a two-shot molding process in which the first shot physicallycouples together two or more of the sections of the enclosure. Thesections may include locking members along their edges to facilitate thephysical coupling during the first shot. The second shot can form one ormore cosmetic structures that may be visible to a user of the electronicdevice. In some embodiments, the cosmetic structures may be exposed toone or more harsh manufacturing processes and/or chemicals. Accordingly,the cosmetic structures may include materials chosen for their abilityto maintain an aesthetically pleasing appearance while withstanding suchprocessing.

According to still further embodiments, one or more peripheral edges ofthe enclosure may be chamfered or otherwise trimmed for aesthetic and/ortactile purposes. The edge(s) may be trimmed, for example, after thefirst-shot molding process but before the second-shot molding process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a portable electronic deviceconfigured in accordance with an embodiment of the disclosure.

FIG. 2 is a schematic perspective view of a subassembly of a portableelectronic device in accordance with some embodiments of the disclosure.

FIG. 3 shows a top view of an of an outer periphery component of anelectronic device in accordance with some embodiments.

FIG. 4 shows a perspective view of the back side of an outer peripherycomponent in accordance with some embodiments.

FIG. 5 shows a detailed cross-sectional view of an outer peripherycomponent in accordance with some embodiments.

FIG. 6 shows an exploded view of the detailed view of the outerperiphery component shown in FIG. 5 in accordance with some embodiments.

FIG. 7 shows a perspective view of extruded sections of an electronicdevice housing in accordance with some embodiments.

FIG. 8 shows a perspective view of a portion fo an outer peripherycomponent of an electronic device including one or more retention holesformed therethrough in accordance with some embodiments.

FIGS. 9A and 9B show a threaded insert positionable within retentionhole 860, which can include one or more elements for receiving afastener in accordance with some embodiments.

FIG. 10 shows a perspective view of an outer periphery componentincluding cover plates in accordance with some embodiments.

FIG. 11 shows a cross-sectional view of biasing mechanisms passedthrough holes in a coupling member towards the underside of a coverplate to bias cover plate against a flat datum surface in accordancewith some embodiments.

FIGS. 12-15 show illustrative processes for creating a housing for anelectronic device in accordance with some embodiments.

DETAILED DESCRIPTION OF THE DISCLOSURE

The following disclosure describes various embodiments of electronicdevices, such as portable electronic devices including, for example,cellular telephones, and the like. Certain details are set forth in thefollowing description and FIGS. to provide a thorough understanding ofvarious embodiments of the present technology. Moreover, variousfeatures, structures, and/or characteristics of the present technologycan be combined in other suitable structures and environments. In otherinstances, well-known structures, materials, operations, and/or systemsare not shown or described in detail in the following disclosure toavoid unnecessarily obscuring the description of the various embodimentsof the technology. Those of ordinary skill in the art will recognize,however, that the present technology can be practiced without one ormore of the details set forth herein, or with other structures, methods,components, and so forth.

The accompanying FIGS. depict several features of embodiments of thepresent technology and are not intended to be limiting of its scope.Many of the details, dimensions, angles, and other features shown in theFigures are merely illustrative of particular embodiments of thedisclosure. Accordingly, other embodiments can have other details,dimensions, angles, and/or features without departing from the spirit orscope of the present disclosure.

An electronic device can include several components assembled togetherto form internal and/or external features of the electronic device. Forexample, one or more internal components (e.g., electrical circuitryand/or internal support structures) can be placed within externalcomponents (e.g., housing structures) to provide an electronic devicehaving desired functionality. As used herein, the term “component”refers to a distinct entity of an electronic device. Components mayinclude, for example, electronic circuit elements (e.g., a microchip),one or more members forming the housing of the electronic device (e.g.,a backplate or an outer periphery component), and internal supportstructures (e.g., a mid-plate).

In some cases, a component can be manufactured by assembling andconnecting two or more different individual elements (i.e., “sections”)together. As used herein, the term “section” can refer to an individualportion of a component, where that component may be formed from multiplesections. The various sections of the component may then be coupledtogether using a “coupling member.” For example, the electronic devicemay include an enclosure component assembled from two or more sections,which are joined together with one or more coupling members.

Based on the desired functionality and design of the component and itssections, these coupling members can exhibit a wide range of shapes andstructures. For example, the coupling members can include structuralelements that can reinforce areas of high mechanical strain, counteracttwisting movements at areas of high torsion, interlock two sectionstogether such that they are mechanically coupled together, provideelectrical isolation between two or more sections, and the like.

FIG. 1 is a schematic perspective view of an electronic device 10.Electronic device 10 may be any one of a number of electronic devicesincluding, but not limited to, cellular telephones, smartphones, otherwireless communication devices, personal digital assistants, audioplayers, video players, game players, other media players, musicrecorders, video recorders, cameras, other media recorders, radios,medical devices, vehicle transportation instruments, calculators,programmable remote controls, pagers, laptop computers, desktopcomputers, printers, and combinations thereof. In some cases, electronicdevice 10 may perform multiple functions (e.g. play music, displayvideo, store pictures, and receive and transmit telephone calls).

In the illustrated embodiment, electronic device 10 includes a body 11incorporating a display 12. Display 12 can include a cover or coverglass 14 that is operably coupled to a frame, housing, or enclosure 16.In certain embodiments, display 12 may allow a user to interact with orcontrol electronic device 10. For example, display 12 and/or cover glass14 can include touch-sensitive features to receive input commands from auser. In various embodiments, a cover or cover glass can encompass mostof the surface area (e.g., 50%-100%) of one side of electronic device 10(as shown in FIG. 1), and a cover or cover plates can be positioned onan opposing side of electronic device 10 (not shown). As described indetail below, enclosure 16 and the cover glass 14 can at least partiallyhouse or enclose several internal components of the electronic device.According to some embodiments, cover glass 14 may be made from a glass(e.g., a pigmented or non-pigmented aluminosilicate glass) or othersuitable material (e.g., sapphire).

In the embodiment illustrated in FIG. 1, enclosure 16 also at leastpartially defines several additional features of the electronic device10. In particular, the enclosure 16 can include audible speaker outlets18, a connector opening 20, an audio jack opening 22, a card opening 24(e.g., SIM card opening), a front facing camera 26. Though not shown inFIG. 1, enclosure 16 may also include a rear facing camera, a powerbutton, and one or more volume buttons. Although FIG. 1 schematicallyillustrates several of these features, one of ordinary skill in the artwill appreciate that the relative size and location of these featurescan vary.

In certain embodiments, enclosure 16 can be made from a metallicmaterial. For example, enclosure 16 can be made from aluminum or analuminum alloy such as 6063 Aluminum. In other embodiments, however,enclosure 16 can be made from other materials, including suitablemetals, alloys, and/or plastics.

As shown in FIG. 1, enclosure 16 can include opposing edge portions 30(identified individually as a first edge portion 30 a and a second edgeportion 30 b) extending around a periphery of the body 11. In certainembodiments, one or both of edge portions 30 can have a chamfered,beveled, or other suitably shaped profile. As described in detail below,edge portions 30 may be formed to provide an aesthetically appealingappearance for enclosure 16.

According to some embodiments, the exterior surface of enclosure 16 canbe exposed to a first treatment, edge portions 30 may be formed, and theexterior surface of enclosure 16, including edge portions 30, can beexposed to a second treatment. In one embodiment, for example, a firstanodization process can be applied to enclosure 16 before edge portions30 are chamfered, and a second subsequent anodization process can beapplied to enclosure 16 after edge portions 30 have been chamfered.Additional suitable surface treatments, including intermediary surfacetreatments, can be applied to enclosure 16 and/or edge portions 30. Instill further embodiments, edge portions 30 can have other suitableprofiles or shapes including and/or surface treatments.

According to some embodiments, the anodization processes referred toabove can be similar to those disclosed in co-pending U.S. Ser. No.13/332,288, filed Dec. 20, 2011, which is incorporated by referenceherein in its entirety (Attorney Docket No. P12600US1 (2607.3770000)).In some embodiments, the anodization processes can be similar to thosedisclosed in U.S. patent application Ser. No. ______, filed Sep. 11,2012, entitled, “Anodizing Process,” (Attorney Docket No. P15103US1),the disclosure of which is incorporated by reference herein in itsentirety. For example, the processes can include applying a mask to aportion of a metal surface (e.g., a portion of enclosure 16) using aphotolithographic process. After the mask is applied, the metal surfacecan be exposed to one or more texturizing processes, includingmachining, brushing, blasting, or chemically etching the surface.

Further, the metal surface can be exposed to an anodization process,which can convert a portion of the metal surface into a metal oxide forincreased corrosion resistance, wear resistance, and or to obtain adesired cosmetic effect (e.g., colorization via absorption of dyes ormetals). The anodization process may be performed before or after thephotolithographic mask is removed. In some embodiments, a firstphotolithographic mask can be removed and a second photolithographicmask can be applied before performing the anodization process. In stillfurther embodiments, and as described above, the metal surface may beexposed to more than one anodization process. One or more finishingprocesses (e.g., polishing or sealing) may also be performed on themetal surface. In some embodiments, a first portion of the housing maybe exposed to a first anodization process and a second portion of thehousing may be exposed to a second anodization process.

FIG. 2 is a schematic perspective view of a subassembly 40 of electronicdevice 10 of FIG. 1. In the embodiment illustrated in FIG. 2,subassembly 40 includes enclosure 16 coupled to a cover glass, such asthe cover glass 14 shown in FIG. 1. As shown in FIG. 2, enclosure 16 caninclude a first enclosure section 42 coupled to a second enclosuresection 44, which is in turn coupled to a third enclosure section 46.Additionally, enclosure 16 can include a first coupling member 48 thatcouples first enclosure section 42 to second enclosure section 44 at afirst interface 43. Enclosure 16 can also include a second couplingmember 50 that couples second enclosure section 44 to third enclosuresection 46 at a second interface 45. As assembled, subassembly 40 formsa five-sided structure, or tub, that can be enclosed on its sixth sideby cover glass 14.

In certain embodiments, the first, second, and third enclosure sections42, 44, and 46 can be metallic, and the first and second couplingmembers 48 and 50 can be made from one or more plastic materials. Asdescribed below in detail, for example, each of the first and secondcoupling members 48 and 50 can be formed from a two-shot molding processthat may include a first plastic portion that joins the correspondingenclosure portions and a second cosmetic plastic portion that at leastpartially covers the first plastic portions. As further described indetail below, these plastic portions can be configured to withstandharsh chemicals and manufacturing processes (e.g., the texturizing andanodization processes described above) that may be used to form andprocess the enclosure. In further embodiments, the enclosure sections42, 44, and 46 and/or the first and second coupling members 48 and 50can be made from any suitable materials including metallic, plastic,and/or other materials.

According to additional features of the embodiment illustrated in FIG.2, enclosure 16 can include one or more low resistance conductiveportions 52 (shown schematically) for grounding purposes. Conductiveportion 52 can be formed by removing one or more layers or portions ofthe enclosure 16 to provide a lower resistance through enclosure 16 forantenna transmissions or communications. In certain embodiments, forexample, the conductive portion 52 can be formed by laser etching orotherwise removing or etching an anodized portion of enclosure 16. Theexposed surfaces of conductive portion 52 can then be chemically treatedto retain its electrical conductivity. Examples of suitable chemicaltreatment include chromate and non-chromate conversion coatings topassivate conductive portion 52. These coatings can be applied usingtechniques including spraying and brushing using a paint brush. Theconductivity of conductive portion 52, as well as through differentportions of enclosure 16, can be tested using suitable techniques suchas using resistance using probes at different points of conductiveportion 52 and enclosure 16 to assure that ground can be establishedthough enclosure 16.

The illustrated subassembly 40 also includes several inserts 54 that canprovide increased structural support and functionality for enclosure 16.In embodiments in which the enclosure 16 is formed from aluminum, forexample, inserts 54 can increase strength and durability of enclosure 16by providing mounting points for structural and/or functional internalcomponents. Additionally, in certain embodiments, inserts 54 can includethreaded inserts or nuts that are configured to threadably engage acorresponding fastener. Inserts 54 formed from titanium may beadvantageous as titanium can withstand harsh manufacturing processes andchemicals to which subassembly 40 may be subjected. In otherembodiments, however, inserts 54 can be made from other suitablematerials including, for example, steel, stainless steel, or brass.

According to yet additional features of the subassembly 40 not visiblein FIG. 2, but described in detail below with respect to FIGS. 10, 11,and 15, cover plates can be securely coupled, and offset if desired,relative to one side of the five-sided enclosure 16. In particular, thecover plates can be aligned with a reference plane or datum relative toenclosure 16. In order to maintain tight tolerance between the coverplates and enclosure sections 42, 44, and 46, enclosure 16 can includeone or more access openings 56 that may be used to urge or bias thecover plates relative to the enclosure 16 for secure attachment (e.g.,an adhesive attachment). For example, one or more springs may beinserted through access openings 56 to bias the cover plates against aplanar structure until an applied adhesive sets.

FIG. 3 shows a top view of an of an outer periphery component 100 of anelectronic device in accordance with some embodiments. In particular,FIG. 3 shows a view of outer periphery component 100, which may beassembled from sections 110, 120, and 130. Outer periphery component 100may generally represent a more detailed view of subassembly 40 of FIG.2. For example, top section 110, center section 120, and bottom section130 may correspond to first enclosure section 42, second enclosuresection 44, and third enclosure section 46, respectively. Outerperiphery component 100 can be constructed to form an exterior,peripheral surface for an electronic device. In particular, outerperiphery component 100 can surround or enclose some or all of theinternal components (e.g., electronic circuits, internal supportstructures, and the like) of the electronic device. In other words,outer periphery component 100 can define an internal volume into whichinternal components can be placed.

The thickness, length, height, and cross-section of outer peripherycomponent 100 may be selected based on any suitable criteria including,for example, structural requirements (e.g., stiffness or resistance tobending, compression, and tension or torsion in particularorientations). In some embodiments, outer periphery component 100 canserve as a structural member to which other electronic device componentscan be mounted. Some of the structural integrity of outer peripherycomponent 100 can come from the closed shape that it defines (e.g.,outer periphery component 100 forms a loop, thus providing structuralintegrity).

Outer periphery component 100 can have any suitably shapedcross-section. For example, outer periphery component 100 can have asubstantially rectangular cross-section. Each corner of thesubstantially rectangular cross-section can be chamfered or rounded inshape, thus forming a “spline.” As used herein, the term “spline” refersto a rounded corner portion of an outer periphery component. In someembodiments, outer periphery component 100 can have a cross-section inany other suitable shape including, for example, a circular shape, anoval shape, a polygonal shape, or a curved shape. In some embodiments,the shape or size of the cross-section of outer periphery component 100can vary along the length or width of the electronic device (e.g., anhourglass shaped cross-section). The spline may be formed by trimmingone or more edges of outer periphery component 100 as described indetail below with respect to FIG. 4.

Outer periphery component 100 of the electronic device can beconstructed using any suitable process. In some embodiments, outerperiphery component 100 can be constructed by connecting top section 110and center section 120 together at interface 112, and connecting centersection 120 and bottom section 130 together at interface 122. Althoughouter periphery component 100 is illustrated in FIG. 3 as beingconstructed from three sections, one skilled in the art could appreciatethat outer periphery component 100 could alternatively be formed fromany suitable number of two or more sections, and that the interfacesbetween the sections may be positioned at any location on outerperiphery component 100.

Each section 110, 120, and 130 can be constructed individually and laterassembled to form outer periphery component 100. For example, eachsection can be individually constructed using one or more of stamping,machining, working, casting, extrusion, or any combinations of these. Insome embodiments, the materials selected for sections 110, 120, and 130can be conductive, thus allowing the sections to provide an electricalfunctionality for the electronic device. For example, sections 110, 120,and 130 can be formed from a conductive material such as stainless steelor aluminum. In one particular embodiment, sections 110, 120, and 130may be constructed from 6063 Aluminum. In some embodiments, each sectionmay serve as an antenna for the electronic device.

To mechanically couple individual sections together, coupling members114 and 124 can exist at interfaces 112 and 122, respectively. In someembodiments, each of the coupling members can be constructed from amaterial that can begin in a first state and may subsequently change toa second state. As an illustration, the coupling members can beconstructed from a plastic that begins in a first, liquid state and thensubsequently changes to a second, solid state. For example, the couplingmembers may be formed using one or more injection molding processes.

In some embodiments, the coupling member can be constructed from aglass-filled polyethylene terephthalate (“PET”). Alternatively, thecoupling member can be constructed from a high-strength plastic such aspolyaryletherketone (“PAEK”) or polyether ether ketone (“PEEK”). Whilein the liquid state, the plastic can be allowed to flow into interfaces112 and 122. After flowing into these interfaces, the plastic materialmay subsequently be allowed to harden into coupling members 114 and 124(e.g., the plastic material is allowed to change into the second, solidstate). Upon changing into the solid state, the plastic material maythen physically bond top section 110 to center section 120 along a firstedge of center section 120, and center section 120 and bottom section130 along a second edge of center section 120, thus forming a single newcomponent (e.g., outer periphery component 100).

Coupling members 114 and 124 not only physically couple togethersections 110 and 120, and sections 120 and 130; they may alsoelectrically isolate top section 110 from center section 120, and centersection 120 from bottom section 130. As will be explained in more detailbelow, coupling members 114 and 124 may include locking structures thatare attached to integrally formed parts of sections 110, 120, and 130.That is, when the coupling member is in its first state (e.g., theliquid state), it can flow into and/or around the locking structures ofsection 110, 120, and/or 130. A shutoff device (e.g., an insert mold,not shown) may be positioned at each interface to shape the couplingmember for when it transforms into its second state (e.g., the solidstate).

Coupling members 114 and 124 can be constructed to span a width of outerperiphery component 100, as shown in FIG. 3. A portion of the couplingmembers 114 and 124 can interface with locking members existing on thesidewalls of sections 110, 120, and 130, and other portions of couplingmembers 114 and 124 can interface with additional locking membersexisting on the edge of the sections. In some embodiments, the physicalcoupling between coupling members 114 and 124 and sections 110, 120, and130 may be reinforced with one or more fasteners.

FIG. 4 shows a perspective view of the back side of outer peripherycomponent 100 in accordance with some embodiments. Outer peripherycomponent can include top section 110, center section 120, bottomsection 130, and interfaces 112 and 122. As can be seen in FIG. 4,center section 120 can form three sides of the five-sided outerperiphery component 110, which can form a tub shape. The three sides ofcenter section 120 can include a planar region 120 a, a first sidewall120 s, and a second sidewall (not visible). The sidewalls may extendperpendicularly from planar region 120 a.

Top section 110 and bottom section 130 can each be U-shaped members thatinclude outer surfaces 110 a and 130 a, respectively. Top section 110and bottom section 130 can also include inner surfaces (not shown). Asassembled into outer periphery component 100, a plane co-planar withplanar region 120 a of section 120 can be perpendicular to any planethat is co-planar with outer surfaces 110 a and 130 a of sections 110and 130.

Also visible in FIG. 4 are cover plates 170 a and 170 b, which will bediscussed in more detail below with respect to FIGS. 10 and 11. Coverplates 170 a and 170 b may be coupled to outer periphery component 100such that outer surfaces 171 a and 171 b are flush with an outer surfaceof at least one side of outer periphery component 100 (e.g., an outersurface of center section 120). Cover plates 170 a and 170 b may eachencompass any suitable surface area on the side of outer peripherycomponent 100 (e.g., 1% to 50%).

Outer periphery component 100 can also include chamfered edges 116 a and116 b. As noted above, chamfered edges can have any suitable shape(e.g., chamfer, round, or ogee), thus giving outer periphery component100 any suitable cross-sectional shape. Chamfered edges 116 a and 116 bmay be aesthetically and tactilely pleasing features for outer peripherycomponent 100.

According to some embodiments, chamfered edges 116 a and 116 b may beformed after one or more molding processes that are used to create oneor more coupling members 114 and 124. For example, top section 110 andcenter section 120 may be coupled together with coupling member 114 atinterface 112. Excess material from the molding of the coupling membersthat extends beyond the outer surface of outer periphery component 100may be ground down, and outer periphery component 100 can be exposed toone or more finishing processes (e.g., anodization, texturization, orpolishing).

One or more sections of the coupling members may then be machined toready outer periphery component 100 for a second molding process, whichcan form cosmetic outward facing components for the coupling members.Excess material from the second molding process may be removed (e.g.,ground down), and then chamfered edges 116 a and 116 b can be machined,trimmed, ground, or otherwise processed to produce a desired edgeprofile (e.g., a chamfered edge profile). For example, the excessmaterial from the second molding process may be removed in aco-finishing process such that the material is flush with chamferededges 116 a and 116 b, planar region 120 a, first sidewall 120 s (andthe second sidewall, not visible), and outer surfaces 110 a and 130 a ofsections 110 and 130, respectively. After chamfered edges 116 a and 116b are formed, outer periphery component 100 may be exposed to one ormore additional finishing processes (e.g., a second anodizationprocess).

FIG. 5 shows detailed cross-sectional view of a portion of outerperiphery component 100 taken along line A-A′ of FIG. 4. In particular,FIG. 5 shows a cross-sectional view of coupling member 114, top section110, and a portion of center section 120 of outer periphery component100. Coupling member 114 (and coupling member 124, which is not shown inthis detailed view of outer periphery component 100) can be constructedto include a first-shot component 114 a and a second-shot component 114b.

Coupling members 114 and 124 (not shown) can be exposed to variousphysically and chemically harsh environments during the manufacturingprocess. For example, the side walls and back plate of an electronicdevice can undergo polishing or lapping operations, which can involvethe use of very acidic (around pH 2) and/or very alkali (around pH 8-9)slurries depending on whether the polishing is a fine or rough polishingprocedure. In addition, during a photolithography process, the devicecan be exposed to UV light during UV curing stage and developing stage,as well as exposure to a strong base such as sodium hydroxide forrinsing away non-cured photoresist material. Furthermore, during ananodizing process, the device can be subjected to a variety of acidicand alkali solutions at elevated temperatures and for extended amountsof time, as described above with reference to anodizing techniques. If ablasting, or other texturizing, procedure is used, the plastic materialcan be exposed to a pressurized blasting media. Additionally, duringde-masking (used to remove photoresist material) the device can beexposed to acidic or alkali rinses solutions at elevated temperatures.Moreover, during a CNC the device can be exposed to cutting fluids. Thefirst shot and second shot materials can be unaffected by one or more ofthe above described processes in that they can maintain structuralintegrity and can appear substantially unmarred. It should be noted thatin some embodiments a mask can be used to prevent degradation ofportions of plastic during some of the processes described above. Forexample, a mask can be used to protect plastic during higher intensityUV exposure during photolithography and during certain CNC steps toprotect the plastic surface from scratching. Any suitable mask toprotect the plastic can be used. In one embodiment, a UV curable polymermask is used.

In embodiments described herein the materials used to form couplingmembers 114 and 124, can be configured to withstand some or all theabove described physical and chemical conditions. First-shot component114 a and second-shot component 114 b can be made of different materialsto serve different functions. In some embodiments, the first-shotcomponent 114 a can be formed from a relatively stronger material so asto provide structural support for the electronic device and second-shotcomponent 114 b can be formed from a softer but more cosmeticallyappealing material for aesthetic purposes. In certain embodiments, bothfirst-shot component 114 a and second-shot component 114 b can beconfigured to withstand some or all of the above described physical andchemical conditions. For example, first-shot component 114 a andsecond-shot component 114 b can be formed from a high mechanicalstrength thermoplastic polymer resin such as a glass-filled PAEK or PEEKmaterial. In other embodiments a glass-filled PET material can be used.In preferred embodiments, second-shot component 114 b can appear smoothand even, thereby providing a more cosmetically appealing appearancethan first-shot component 114 a. In some cases, the second-shotcomponent 114 b can take on any of a number of colors.

First-shot component 114 a can be responsible for physically couplingtogether the sections (e.g., section 110 and section 120) of outerperiphery component 100 and can be machined to include retaining regionsfor receiving the second shot. Second-shot component 114 b can functionas a cosmetic component that is self-anchored within the retainingregion of first-shot component 114 a. Second-shot component 114 b may bethe only part of coupling member 114 that is visible to the user whenthe device is fully assembled. Because second-shot component 114 b maybe visible and exposed to the environment, including during one or moreharsh processing steps, it can be formed from a material suitable formaintaining an aesthetically pleasing appearance (e.g., polyether imide(“PEI”)) notwithstanding such processing. Additionally, second-shotcomponent 114 b can have any suitable color.

According to some embodiments, first-shot component 114 a can beinjection molded between top section 110 and center section 120. Inparticular, top section 110 and center section 120 can be inserted intoan injection mold (not shown), and the material for forming first-shotcomponent 114 a can be injected into the mold cavity. In someembodiments, the injection mold may define one or more features and/orboundaries of first-shot component 114 a, including one or more ofelements 161-167 and/or coupling member edge 115. Alternatively,elements 161-167 and/or coupling member edge 115 can be formed (e.g., bygrinding, machining, or otherwise trimming first-shot component 114 a)after the material has cooled and set.

Coupling member 114 (and coupling member 124, not shown) may bemachined, for example, to have holes, recesses, retention features, orany other desired features after it is applied as a first shot. Suchmachined features are illustratively shown as elements 161-167. Forexample, elements 161-164 are holes, and elements 165-167 arerectangular cutouts. These machine features may enable cables to passfrom one side of the coupling member to another or to enable secureplacement of various components such as a button, a camera, amicrophone, a speaker, an audio jack, a receiver, a connector assembly,or the like. Additionally, one or more of elements 161-164 can be anantenna window via which an antenna can radiate and/or receive signals.

FIG. 6 shows an exploded view of the detailed view of coupling member114, top section 110, and center section 120 of outer peripherycomponent 100 shown in FIG. 5. First-shot component 114 a can includeinterface features 141-147 for interfacing with locking mechanisms151-159 of sections 110 and 120. According to some embodiments,interface features 141-147 may be formed during a first-shot injectionmolding process in which the material that forms first-shot component114 a fills the interstices that define locking mechanisms 151-159 ofsections 110 and 120.

According to some embodiments, coupling member 114 can interface withsidewall locking mechanisms 151-154 and edge locking mechanisms 155-157with sidewall interface features 141-144 and edge interface features145-147, respectively. In some embodiments, sidewall interface features141-144 can be referred to as “knuckles.” In particular, sidewallinterface features 141 and 143 can form a first knuckle, and sidewallinterface features 142 and 144 can form a second knuckle. Edge interfacefeatures, on the other hand can be formed on a “span” of coupling member114, which extends between the two knuckles. When coupling member 114 isapplied in a liquid state (e.g., into an injection mold), it can flowinto and/or around locking mechanisms 151-157. When the material setsand turns into a solid as coupling member 114, it can form a physicalinterconnect that couples sections 110 and 120 together. Coupling member114 can include fastener through-holes 148 and 149 that line up withholes and or inserts in section 110 such that screws or other fastenerscan be used to secure coupling member 114 to section 110.

First-shot component 114 a may also include second-shot cavities 140 forreceiving second-shot components 114 b. Second-shot cavities 140 mayform recesses in first-shot component 114 a at the interfaces betweensection 110 and section 120 (as well as section 120 and section 130, notshown). According to some embodiments, second-shot cavities 140 may beformed after first-shot component 114 a has been formed. In particular,portions of first-shot component 114 a can be removed (e.g., by sawing,drilling, or machining) to form the recesses for second-shot cavities140.

Portions of sections 110 and 120 abutting first-shot component 114 a mayalso be removed when forming second-shot cavities 140. For example,second-shot cavities 140 can be created by sawing material away fromfirst-shot component 114 a, section 110, and section 120 at theinterfaces between sections 110 and 120. Accordingly, the width ofsecond-shot cavities 140 can be repeated with accuracy, as the width isdetermined solely by the kerf of the saw. Accuracy and repeatability inthe formation of second-shot cavities 140 may be advantageous for anumber of reasons including, for example, antenna performance andaesthetic considerations. In some embodiments, a relatively small amount(e.g., 0.05-0.15 mm) of material may be removed from each of sections110 and 120 during the formation of second-shot cavities 140.

Both second-shot cavities 140 may be formed at the same time. Inparticular, in embodiments in which second-shot cavities 140 are formedby sawing first-shot component 114 a, and/or portions of sections 110and 120, second-shot cavities 140 can be cut together. Additionally, thesame cut that forms second-shot cavities 140 can remove material fromsection 120 across the width of outer periphery component 100 betweenthe second-shot cavities 140. Accordingly, a straight, clean edge can beformed at the edge of section 120, resulting in excellent alignmentbetween the various components of outer periphery component 100.

In further embodiments, second-shot cavities 140 may be formed asfirst-shot component 114 a is molded (e.g., using features included inthe injection mold). Second-shot components 114 b may be purely cosmeticand configured to withstand harsh processing and/or chemicals whilemaintaining an attractive outward aesthetic.

In still further embodiments, coupling member 114 may include onlyfirst-shot component 114 a, with second-shot component 114 b beingformed integrally with first-shot component 114 a. That is, couplingmember 114 may be formed from a one-shot molding process, and thematerial that forms first-shot component 114 a may be visible from theoutside of outer periphery component 100. These embodiments may bepreferable, for example, if the material used to form first-shotcomponent 114 a is aesthetically pleasing even after exposure to one ormore harsh chemicals and/or processes.

FIG. 7 shows a perspective view of extruded sections 710, 720, and 730of an electronic device housing in accordance with some embodiments.Extruded sections 710, 720, and 730 may be cut from extruded parts thatare later machined to form sections 110, 120, and 130, as discussedabove. In some embodiments, extruded sections 710, 720, and 730 can beextruded separately in order to simplify the machining processes thatwill form sections 110, 120, and 130. Alternatively, two or more ofextruded sections 710, 720, and 730 may be cut from the same extrudedpart and cut to size (e.g., the relative sizes shown in FIG. 7). Forexample, top extruded section 710 and bottom extruded section 730 mayboth be cut from the same extruded part. In some embodiments, one ormore of extruded sections 710, 720, or 730 may be bent during or afterextrusion.

According to some embodiments, extruded sections 710, 720, and 730 maybe assembled such that the longitudinal extrusion axis (i.e., the axisalong which the section was extruded) of at least one of the sections(e.g., top extruded section 710 and bottom extruded section 730) isperpendicular to the longitudinal extrusion axis of at least one othersection (e.g., center extruded section 720). For example, thelongitudinal extrusion axes of top extruded section 710 and bottomextruded section 730 may be parallel to the z-axis, while thelongitudinal extrusion axis of center extruded section 720 may beparallel to the y-axis. One or more of extruded sections 710, 720, and730 may be oriented differently in order to facilitate machining ofextruded sections 710, 720, and 730 into, for example, sections 110,120, and 130. For example, it may be difficult or impossible to form thefive-sided tub structure of outer periphery component 100 of from asingle extruded part or multiple extruded parts oriented along the samelongitudinal extrusion axis.

One consequence of orienting one or more sections along differentlongitudinal extrusion axes is that visible grains, which are typicalbyproducts of extrusion processes, may not match between adjacentsections of the assembled electronic device. Accordingly, the materialsand extrusion parameters used to form extruded sections 710, 720, and730, as well as the final orientations of the sections, may be optimizedto minimize the appearance of grain boundaries between adjacentsections. As just one example, extruded sections 710, 720, and 730 maybe formed from a material that is not susceptible to forming visualstretch marks during the extrusion process (e.g., 6063 Aluminum).Accordingly, extruded sections 710, 720, and 730 may appear to have asmooth, continuous, unibody aesthetic after the extruded sections aremachined and assembled. In particular, the five-sided outer peripherycomponent 100, which can be assembled from sections 110, 120, and 130,may appear to be one continuous, unibody component.

Assembling an electronic device housing from separate extruded sections(e.g., extruded sections 710, 720, and 730) can be advantageous inseveral respects. For example, forming sections of an electronic devicehousing from extruded parts can be a cost effective and environmentallyfriendly alternative to conventional methods (e.g., die casting ormolding) as the extrusion process can create long lengths of extrudedparts that cut to appropriate lengths without excessive waste.Additionally, the availability of separately extruded sections can allowfor the formation of detailed locking features (e.g., edge lockingmechanisms 155-157 and sidewall locking mechanisms 151-154 of FIG. 6 andretention holes 860 of FIG. 8), which may not be possible if the housingis formed from a single molded part.

FIG. 8 shows a perspective view of a portion of outer peripherycomponent 100 of an electronic device including one or more retentionholes 860 formed therethrough in accordance with some embodiments. Asshown in FIG. 8, one or more of section 120, coupling member 114, andsection 110 may include one or more retention holes 860 formedtherethrough (or partially therethrough). For example, retention holes860 may be machined or otherwise formed through the material of centersection 120 between a top surface 120 t and a bottom surface 120 b (notshown) of section 120. Alternatively, retention holes 860 may extendonly partially into the section 120 without reaching or extendingthrough bottom surface 120 b.

In some embodiments, section 120 can be made from aluminum or analuminum alloy (e.g., 6063 Aluminum), which may not be suitable forforming threads for receiving a screw. Therefore, the interior surface860 i of retention holes 860 may be substantially continuous and smooth,and thus may not be suitable for receiving and retaining a screwmechanism. A threaded insert 870 may be positioned within and retainedby retention hole 860 such that a screw mechanism may be threadablyretained within a portion of outer periphery component 100.

As shown in FIGS. 9A and 9B, a threaded insert 870 may be positionedwithin retention hole 860. Threaded insert 870 can include one or moreelements for receiving a fastener. For example, threaded insert 870 caninclude threads 872 for receiving and retaining a screw 880. Threadedinsert 870 may be made of any material (e.g., titanium) suitable forreceiving and gripping screw 880 and withstanding harsh chemicals and/orprocesses (e.g., texturization and/or anodization).

Titanium may be particularly suitable for threaded insert 870, becausewhile titanium can anodize under the conditions used for anodizingaluminum, it will anodize only minimally and create little film growth.Thus, the titanium inserts will remain conductive and therefore suitablefor electrical grounding, for example, even after undergoing an aluminumanodizing process. In addition, since anodization will occur minimallyon titanium, the geometry of any threaded regions of the inserts mayremain substantially the same. It should be noted that in addition totitanium, other suitable hard metals materials can be used for thethreaded insert 870, including magnesium, zinc, tantalum, or hardaluminum alloys such as 7075 Aluminum. Inserts made of softer aluminumalloys can be used, however the softer aluminum inserts may anodize inthe aluminum anodizing bath. Therefore, in order to keep the aluminuminserts electrically conductive and to retain any threaded geometry, itcan be necessary to mask the aluminum inserts using, for example polymerplugs, prior to exposure to the anodizing bath. However, this maskingprocess can add time, cost, and manual labor to the process.

Threaded insert 870 may include a cap 874 that may be coupled to a body875. In some embodiments, cap 874 and body 875 can be integrally formed.The external surfaces of threaded insert 870 may be sized and shapedsimilarly to the size and shape of the internal surfaces of retentionhole 860 such that threaded insert 870 can be positioned withinretention hole 860. For example, threaded insert 870 may be press fitinto retention hole 860 (e.g., in the direction of arrow D). In someembodiments, an adhesive may be used to retain threaded insert 870within retention hole 860.

In some embodiments, at least a portion of cap 874 may have a largercross-sectional area than a portion of body 875. A top portion 862 ofretention hole 860 may be larger than the remainder of retention hole860, such that top portion 862 may receive cap 874 and prevent cap 874from being passed through the remainder of retention hole 860. Moreover,cap 874 may include one or more protrusions 873 that may be received byone or more complimentary notches 863 in top portion 862 of retentionhole 860. When each protrusion 873 of cap 874 is aligned with andpositioned within a respective notch 863 in top portion 862 of retentionhole 860, the interaction of each protrusion 873 and notch 863 mayprevent threaded insert 870 from rotating with respect to retention hole860 (e.g., in the direction of arrow S).

Threaded insert 870 may also include a threaded hollow 876 that mayextend through at least a portion of cap 874 and/or through at least aportion of body 875. The interior surface of threaded hollow 876 mayinclude one or more threads 872 that may receive and retaincomplimentary threads 882 of a screw 880 that is rotated down intothreaded hollow 876 (e.g., in the direction of arrow S). As mentioned,due to the interaction of each protrusion 873 and notch 863, threadedinsert 870 may be prevented from rotating within retention hole 860 inthe direction of arrow S while screw 880 may be rotated within threadedhollow 876 of threaded insert 870 in the direction of arrow S. Bypositioning threaded insert 870 within retention hole 860 (e.g., ofsection 120) screw 880 may be screwed into and at least partiallyretained by threaded insert 870 within retention hole 860 such thatscrew 880 can couple section 120 (via threaded insert 870) to anothercomponent of the electronic device assembly (not shown).

FIG. 10 shows a perspective view of outer periphery component 100including cover plates 170 a and 170 b. After coupling members 114 and124 have coupled top section 110 to center section 120 and centersection 120 to bottom section 130, respectively, cover plates 170 a and170 b may be coupled to a bottom side of coupling members 114 and 124,respectively. Cover plates 170 a and 170 b may be formed from anysuitable material or combination of materials (e.g., pigmented glass,white ceramic glass, or sapphire) that may protect one or morecomponents positioned within outer periphery component 100. The materialthat forms cover plates 170 a and 170 b may be chosen for having anumber of desirable qualities, including high strength, stiffness, andhardness or scratch resistance, transparency to radio frequencies,and/or opaqueness to visible light. The material also may be chosenbased on aesthetic considerations (e.g., whether the color of the coverplate coordinates well with other colors of the electronic deviceincorporating outer periphery component 100 that are visible to a user).

According to some embodiments, cover plates 170 a and 170 b may beformed from a pigmented glass (e.g., pigmented aluminosilicate glass).The pigmented glass may be opaque to visible light in order to hide oneor more internal components housed within outer periphery component 100including, for example, coupling members 114 and 124. In theseembodiments, the pigmented glass can be treated with one or moreprocesses to improve its hardness and stiffness. For example, thepigmented glass can be exposed to a potassium nitrate bath, which caninitiate an ion exchange process that strengthens the glass.

Additionally, one or both sides of cover plates 170 a and 170 b (e.g.,outer surfaces 171 a and 171 b and/or their respective opposing sides)formed from pigmented glass may be painted. Painting one or both sidesof cover plates 170 a and 170 b with a dark paint can ensure that thecover plates are, indeed, opaque and add consistency between coverplates manufactured in different batches, lots, plants, etc. Coverplates 170 a and 170 b may be formed from pigmented glass in order tomatch dark colored features included elsewhere in outer peripherycomponent 100 and/or the finished electronic device (e.g., electronicdevice 10 of FIG. 1).

According to some further embodiments, cover plates 170 a and 170 b maybe formed from a ceramic glass material. A base glass for forming theceramic glass may be a glass (e.g., aluminosilicate glass) with severalnucleation sites disposed throughout. The nucleation sites may be formedfrom any suitable impurity introduced into the base glass. The baseglass can then be transformed into ceramic glass by exposure to one ormore temperature cycling processes (e.g., raising and lowering thetemperature of the base glass), which can promote crystal formationaround the nucleation sites, thus forming the ceramic glass. In someembodiments, the ceramic glass may be an opaque, light colored (e.g.,white, off white, or light gray) material. In these embodiments, theceramic glass can be treated with one or more processes to improve itshardness and stiffness. For example, the ceramic glass can be exposed toa sodium nitrate bath, which can initiate an ion exchange process thatstrengthens the glass.

As with the pigmented glass, one or both sides of cover plates 170 a and170 b formed from ceramic glass may be painted. Painting one or bothsides of cover plates 170 a and 170 b with a light (e.g., white, offwhite, or gray) paint can ensure that the cover plates are opaque andadd consistency between cover plates manufactured in different batches,lots, plants, etc. Cover plates 170 a and 170 b may be formed fromceramic glass in order to match light colored features includedelsewhere in outer periphery component 100 and/or the finishedelectronic device (e.g., electronic device 10 of FIG. 1).

According to still further embodiments, although they may be opaque tovisible light frequencies (e.g., 390-750 THz), cover plates 170 a and170 b may be transparent to light at frequencies (e.g., 500-6500 MHz)used for wireless communication. Accordingly, cover plates 170 a and 170b may be used as antenna windows that allow antennas disposed proximatethereto to radiate and receive wireless signals.

According to some embodiments, cover plates 170 a and 170 b can besliced to the appropriate thickness and cut to the appropriate lateraldimensions for incorporation into outer periphery component 100. Coverplates 170 a and 170 b may also be exposed to one or more polishingsteps (e.g., before and/or after the sodium or potassium nitratestrengthening baths).

Furthermore, it may be aesthetically and tactilely advantageous forouter surfaces 171 a and 171 b of cover plates 170 a and 170 b to beflush with outer surface 121 of section 120. Accordingly, to ensure thatouter periphery component 100 has a smooth and continuous outer surface,one or more springs or biasing mechanisms may be provided throughcoupling members 114 and 124 for supporting cover plates 170 a and 170 bwith respect to coupling members 114 and 124 while an adhesive isallowed to set. The adhesive can adhere cover plates 170 a and 170 b tocoupling members 114 and 124, for example.

As shown in FIG. 11, one or more springs or biasing mechanisms 1104(e.g., 1104 a-c) may be passed through holes 125 in coupling member 124towards the underside of cover plate 170 b to bias cover plate 170 bagainst a flat datum surface 1100. Outer surface 121 of section 120 mayalso be held against flat datum surface 1100. According to someembodiments, each biasing mechanism may be independently controlled byits own biasing module 1102 (e.g., 1102 a-c) such that differentportions of cover plate 170 b may be biased with different biasingforces against flat datum surface 1100 for ensuring that all portions ofouter surface 171 b of cover plate 170 b may be flush or in a continuousplane with outer surface 121 of section 120 while an adhesive (notshown) is allowed to dry. The adhesive may secure cover plate 170 b tocoupling member 124 and/or section 120 and/or section 130.

FIG. 12 shows an illustrative process 1200 for creating a housing for anelectronic device in accordance with some embodiments. Beginning at step1201, three separate sections of a housing can be formed. The threeseparate sections can include a top section, a center section, and abottom section. According to some embodiments, the three separatesections may be extruded along a longitudinal extrusion axis and cut tothe appropriate length (e.g., the lengths of extruded sections 710, 720,and 730 of FIG. 7). The three separate sections may be formed from ametallic material (e.g., aluminum, 6063 Aluminum, stainless steel, orany other suitable metal or alloy). One skilled in the art willappreciate that the housing for the electronic device may be assembledfrom any suitable number of sections (e.g., 2-5).

At step 1203, each extruded section can be machined to include lockingmembers and/or other suitable features. The locking members can beformed along one or more edges (e.g., edge locking mechanisms 155-157 ofFIG. 6) and/or sidewalls (e.g., sidewall locking mechanisms 151-154 ofFIG. 5) of each section. According to some embodiments, each extrudedsection may also be machined to reduce the thickness of the walls of theextruded sections. The walls of each extruded section may be machined toa thickness that will optimize the interior volume of the electronicdevice assembled from the sections while retaining suitable structuralintegrity.

At step 1205, a first section is coupled to a second section with afirst coupling member. Similarly, at step 1207, the second section canbe coupled to a third section with a second coupling member. Forexample, as shown in FIG. 3, top section 110 can be coupled to centersection 120 with coupling member 114, and center section 120 can becoupled to bottom section 130 with coupling member 124. According tosome embodiments, the coupling members can be formed at the same time(e.g., during a first-shot injection molding process). Accordingly, thethree separate sections can be set within a mold, and the injectionmolding material (e.g., a suitable liquid plastic material such as PAEKor PEEK) can be injected into the mold. The injection molding materialmay be permitted to flow into one or more of the locking members of thesections and allowed to set, physically coupling the sections together.As an alternative, each of the coupling members can be formedseparately.

At step 1209, the first and second coupling members can be machined toform cosmetic cavities. Because the first and second coupling membersmay be responsible for adding structural support to the electronicdevice housing, the material that forms the coupling members may bechosen primarily for its strength. Accordingly, aesthetic considerationsmay be a secondary concern for the coupling members. However, as part ofthe coupling members may be visible on the exterior of the electronicdevice (e.g., at interfaces 112 and 122 of FIG. 4), the portions of thecoupling members that will be visible can be machined to create cosmeticcavities, (e.g., cavities suitable for receiving second-shot moldedmembers). The second-shot material may be chosen primarily for itsaesthetic qualities.

At step 1211, cosmetic structures can be formed in the cosmeticcavities. According to some embodiments, the cosmetic structures may beformed in the cosmetic cavities using a second-shot injection moldingprocess. As the cosmetic structures may be visible from the exterior ofthe electronic device, a suitable material (e.g., PEI) may be chosen forits ability to maintain a pleasing aesthetic appearance even afterexposure to one or more harsh chemicals (e.g., sulfuric acid and nitricacid) and/or processes (e.g., UV light exposure and anodization). Afterthe cosmetic structures are formed, one or more grinding or sandingprocesses may shape the cosmetic structures such that they are flushwith the outer surfaces of the housing.

At step 1213, first and second cover plates (e.g., cover plates 170 aand 170 b of FIG. 10) can be fixed to the first and second couplingmembers, respectively. The first and second cover plates may be affixedto the first and second coupling members such that outer surfaces of thecover plates are co-planer with at least one outer surface of one of thesections (e.g., outer surface 121 of section 120). Alternatively, thecover plates may be offset by a desired distance from the datum surfacedefined by an outer surface of one of the sections.

According to some embodiments, one or more edges of the housing may bemachined, trimmed, or otherwise altered to form an aesthetically andtactilely pleasing profile. For example, opposing edge portions 30 ofFIG. 1 can be machined to create chamfered edges. According to someembodiments, the edges can be machined after the cosmetic structures areformed at step 1211. For instance, after the cosmetic structures aremolded and shaped as described above, the edges of the housing (andportions of the cosmetic structures) can be machined to form a desirededge profile (e.g., a chamfered edge profile). After the edges aremachined, the housing may be exposed to one or more finishing processes(e.g., anodization). Accordingly, both the material that forms thehousing (e.g., 6063 Aluminum) and the material that forms the cosmeticstructures (e.g., PEI) may be chosen to withstand, and maintain apleasing external appearance, through the finishing processes.

FIG. 13 shows an illustrative process 1300 for creating a housing for anelectronic device in accordance with some embodiments. Beginning at step1301, three separate sections of a housing can be formed. The threeseparate sections can include a top section, a center section, and abottom section. According to some embodiments, the three separatesections may be extruded along a longitudinal extrusion axis and cut tothe appropriate length (e.g., the lengths of extruded sections 710, 720,and 730 of FIG. 7). The three separate sections may be formed from ametallic material (e.g., aluminum, 6063 Aluminum, stainless steel, orany other suitable metal or alloy). One skilled in the art willappreciate that the housing for the electronic device may be assembledfrom any suitable number of sections (e.g., 2-5).

At step 1303, at least one section can be machined to include retentionholes (e.g., retention holes 860 of FIG. 8). The retention holes mayextend from a top surface of a section through a bottom surface (e.g.,top surface 120 t and bottom surface 120 b of section 120 of FIG. 9A).Alternatively, the retention holes may extend through the top surface ofthe section without reaching the bottom surface.

At step 1305, a first section can coupled to a second section with afirst coupling member. Similarly, at step 1307, the second section canbe coupled to a third section with a second coupling member. Forexample, steps 1305 and 1307 may substantially correspond to steps 1205and 1207 as described above with respect to FIG. 12.

At step 1309, the first and second coupling members can be machined toform holes corresponding to the retention holes of the at least onesection. In particular, holes can be formed in the first and secondcoupling members at points where the coupling members overlap retentionholes that were formed at step 1303. In some embodiments, step 1303 maybe omitted, and retention holes can be formed in at least on section andthrough the coupling members simultaneously (e.g., in step 1309).According to certain embodiments, a top section of the retention holesmay be larger than the remainder of the retention holes. Furthermore,one or more notches may be formed in the top sections of the retentionholes.

At step 1311, threaded inserts (e.g., threaded insert 870 of FIG. 9A)may be placed into the retention holes. The threaded inserts may haveouter dimensions that correspond to the dimensions of the retentionholes. For example, if the retention holes include top sections withwider cross-sectional areas than the remainder of the retention holes,the threaded inserts may have include a cap (e.g., cap 874 of FIG. 9A)with a cross-sectional area corresponding to the top sections of theretention holes and a body (e.g., body 875 of FIG. 9A) with across-sectional area corresponding to the remainder of the retentionholes. According to some embodiments, the cap of the threaded insert caninclude one or more protrusions (e.g., protrusions 873 of FIG. 9A) thatcorrespond to notches in the top sections of the retention holes.

The threaded inserts may include a threaded hollow (e.g., threadedhollow 876) that may extend through at least a portion of the cap and/orthrough at least a portion of the body. The interior surface of thethreaded hollow may include one or more threads (e.g., threads 872 ofFIG. 9A) that may receive and retain complimentary threads of a screw(e.g., threads 882 of screw 880 of FIG. 9B) that can be rotated downinto the threaded hollow. In some embodiments the threaded inserts maybe formed from a metal (e.g., titanium). According to some embodiments,the threaded inserts may be press fit into the retention holes and/oraffixed within the retention holes using an adhesive.

At step 1313, fasteners (e.g., screws) may be retained within thethreaded inserts. The fasteners may be used to mount or otherwise coupleone or more internal components of the electronic device to the sectionsof the housing. For example, one or more circuit boards, structuralreinforcing members, cameras, and/or other suitable internal componentsmay be mounted within the electronic device housing assembled from thesections.

FIG. 14 shows an illustrative process 1400 for creating a housing for anelectronic device in accordance with some embodiments. At step 1401, atleast one section of the housing can be extruded. According to someembodiments, a single member can be extruded along a longitudinalextrusion axis cut to lengths appropriate for the sections of thehousing of the electronic device. For example, extruded sections 710,720, and 730 of FIG. 7 may be cut from a single extruded member. Inother embodiments, any of the sections of the housing can be extrudedseparately. For example, extruded sections 710, 720, and 730 can eachextruded separately and cut to length or extruded sections 710 and 730may be cut from the same extruded member and center extruded section 720may be extruded separately.

The sections may be formed from any suitable material (e.g., aluminum,6063 Aluminum, stainless steel, or plastic). According to someembodiments, however, the material and various extrusion parameters(e.g., extrusion rate, temperature, etc.) may be chosen to minimize theappearance of any stretch marks or grains resulting from the extrusionprocess. For example, 6063 Aluminum may be chosen for the material.Accordingly, when the sections are joined together, the housing canappear to be of a seamless, unibody construction without noticeablegrain boundaries between the sections.

At step 1403, each extruded part can be machined to the desireddimensions of the housing. For example, the extruded parts can bemachined to form sections 110, 120, and 130 of FIG. 3. In particular,the thickness of the each extruded part can be machined to a thicknessthat can optimize the interior volume of the electronic device housingassembled from the sections while retaining suitable structuralintegrity. Other features may also be formed in the extruded parts atstep 1403, including one or more retention holes (e.g., retention holes860 of FIG. 8) and/or locking members (e.g., locking members 151-157 ofFIG. 6).

According to some embodiments, steps 1401 and 1403 may be combined. Inparticular, a single member can be extruded along a longitudinalextrusion axis and machined to form the desired dimensions of thehousing. For example, a single member in the shape of a rectangularprism may be extruded and then material can be removed (e.g., bymachining) to form the housing. The housing can be a five-walled, tubshaped housing with a rectangular, planar surface and four sidewallsextending perpendicularly from the rectangular, planar surface asdepicted schematically in FIG. 2, for example. In some embodiments, thesingle member can be cut into individual sections (e.g., sections 710,720, and 730) before or after machining. Furthermore, additionalmaterial may be removed from one or more of the sections to form awindow in the rectangular, planar surface.

At step 1405, the sections can be rotated such that the longitudinalextrusion axis of at least one of the sections is oriented perpendicularto the longitudinal extrusion axis of at least one other section. Forexample, the longitudinal extrusion axes of two of the sections (e.g.,top section 110 and bottom section 130) may be oriented perpendicular tothe longitudinal extrusion axis of a third section (e.g., center section120 of FIG. 3).

At step 1407, the sections can be physically coupled together using oneor more coupling members to create the housing of the electronic device.This step may be substantially similar to those described in steps 1205and 1207 of FIG. 12.

FIG. 15 shows an illustrative process 1500 for creating a housing for anelectronic device in accordance with some embodiments. At step 1501,cover plates can be coupled to coupling members accessible via a backside of an electronic device housing. For example, cover plates 170 aand 170 b can be coupled to coupling members 114 and 124, respectively,of outer periphery component 100 of FIG. 10. According to someembodiments, the cover plates can be coupled to the electronic devicehousing with an adhesive (e.g., an epoxy).

At step 1503, the electronic device housing can be placed against aplanar datum surface. For example, to ensure that the outer surfaces ofthe cover plates are flush with an outer surface of the electronicdevice housing (e.g., outer surfaces of 171 a and 171 b of cover plates170 a and 170 b are flush with outer surface 121 of section 120 of FIG.10), the outer surfaces can be placed against a planar datum surface(e.g., flat datum surface 1100 of FIG. 11). The planar datum surface canbe any flat surface external to the electronic device.

At step 1505, the electronic device housing, including the cover plates,can be biased against the planar datum surface with one or more biasingmechanisms. For example, the electronic device can be biased against theplanar datum surface with any suitable external force (e.g., a biasingmechanism such as a spring or gravity). Additionally, the cover platescan be biased against the planar datum surface with one or more biasingmechanisms (e.g., springs). The biasing mechanisms (e.g., biasingmechanisms 1104 a-c) may be passed through holes (e.g., holes 125 incoupling member 124) towards the underside of the cover plates to thecover plates against the flat datum surface 1100. According to someembodiments, each biasing mechanism can be separately controlled by abiasing module (e.g., biasing modules 1102 a-c) such that differentportions of the cover plates may be biased with different biasing forcesagainst the flat datum surface to ensure that the outer surfaces of thecover plates and the outer surface of the electronic device are flush.At step 1507, the adhesive may be allowed to dry while the electronicdevice housing is biased against the planar datum surface.

It should be understood that the processes described above are merelyillustrative. Any of the steps may be removed, modified, or combined,and any additional steps may be added or steps may be performed indifferent orders, without departing from the scope of the invention.

The described embodiments of the invention are presented for the purposeof illustration and not of limitation.

What is claimed is:
 1. A method for forming a housing of an electronicdevice, the method comprising: coupling cover plates to coupling membersaccessible via a backside of the housing of the electronic device withan adhesive; placing the backside of the housing against a planar datumsurface; biasing the housing of the electronic device, including thecover plates, against the planar datum surface with one or more biasingmechanisms; and allowing the adhesive to dry while the housing of theelectronic device is biased against the planar datum surface.
 2. Themethod of claim 1, wherein the adhesive is an epoxy.
 3. The method ofclaim 1, wherein the backside of the housing comprises a planar outersurface of the electronic device, and wherein outer surfaces of thecover plates are flush with the planar outer surface of the electronicdevice after the adhesive dries.
 4. The method of claim 1, wherein theplanar datum surface is a flat surface external to the electronicdevice.
 5. The method of claim 1, wherein the biasing mechanisms thatbias the cover plates against the planar datum surface are insertedthrough holes formed in the coupling members.
 6. The method of claim 1,wherein a separate biasing module controls each biasing mechanism.
 7. Asystem for coupling cover plates to a housing of an electronic device,comprising: a planar datum surface; and a plurality of biasingmechanisms controlled by one or more biasing modules, wherein thebiasing mechanisms are configured to bias at least one object towardsthe planar datum surface.
 8. The system of claim 7, wherein the biasingmechanisms are configured to bias the cover plates and the housing ofthe electronic device against the planar datum surface.
 9. The system ofclaim 8, wherein the cover plates and the housing each comprise at leastone planar outer surface that is biased against the planar datum surfaceby the biasing mechanisms.
 10. The system of claim 9, wherein thebiasing mechanisms are configured to bias the housing and the coverplates for a period of time suitable for an adhesive for coupling thecover plates to the housing to dry.
 11. The system of claim 8, wherein aseparate biasing module controls each biasing mechanism.
 12. The systemof claim 8, wherein a single biasing module controls more than onebiasing mechanism.
 13. An electronic device comprising: a housing; anantenna disposed within the housing; and a cover plate coupled to thehousing proximate to the antenna, wherein the cover plate is transparentto light at frequencies used by the antenna for wireless communication,and wherein the cover plate is opaque to light at visible frequencies.14. The electronic device of claim 13, wherein the cover plate comprisesone of pigmented glass, ceramic glass, and sapphire.
 15. The electronicdevice of claim 13, further comprising a cover glass coupled to a firstside of the housing, wherein the cover plate is coupled to a second sideof the housing opposite the first side.
 16. The electronic device ofclaim 15, wherein the cover glass comprises 50% to 100% of a surfacearea of the first side.
 17. The electronic device of claim 15, whereinthe cover plate comprises 1% to 50% of a surface area of the secondside.
 18. The electronic device of claim 13, wherein at least one sideof the cover plate is painted.
 19. The electronic device of claim 15,further comprising a second cover plate coupled to the second side ofthe housing.
 20. The electronic device of claim 13, wherein the secondcover plate is transparent to light at frequencies used by a secondantenna for wireless communication, and wherein the second cover plateis opaque to light at visible frequencies.
 21. The electronic device ofclaim 13, wherein the frequencies used by the antenna for wirelesscommunication are from about 500-6500 MHz.